The performance of an IC design is no longer limited to how many million transistors a vendor fits on a single chip. With tighter packaging space and increasing clock frequencies, packaging and system-level performance issues such as crosstalk and transmission lines are becoming increasingly significant.
At the same time, with the popularity of multichip packages and increased I/O counts, package design itself is becoming more and more like chip design.
This chapter describes how to maintain signal integrity for your design, and covers the following topics: