LEVEL 5 IDS Model

This section describes the LEVEL 5 IDS model parameters and equations.


NOTE: This model uses micrometer units rather than the typical meter units. Units and defaults are often unique in LEVEL 5. The option SCALM is ineffective for this level.

LEVEL 5 Model Parameters

The LEVEL 5 model parameters follow.

Basic Model Parameters

Name (Alias)

Units

Default

Description

LEVEL

 

1.0

Model level selector

DNB (NSUB)

cm -3

0.0

Surface doping

DP

µm

1.0

Implant depth (depletion model only)

ECV

V/µm

1000

Critical field

NI

cm -2

2e11

Implant doping (depletion model only)

PHI

V

0.8

Built-in potential

TOX

Å

0.0

Oxide thickness

TUH

 

1.5

Implant channel mobility temperature exponent (depletion model only)

ZENH

 

1.0

Mode flag (enhancement). Set ZENH=0.0 for depletion mode.

Effective Width and Length Parameters

Name (Alias)

Units

Default

Description

DEL (WDEL)

µm

0.0

Channel length reduction on each side

LATD (LD)

µm

1.7 · XJ

Lateral diffusion on each side

LMLT

 

1.0

Length shrink factor

OXETCH

µm

0.0

Oxide etch

WMLT

 

1.0

Diffusion layer and width shrink factor

Threshold Voltage Parameters

Name (Alias)

Units

Default

Description

FSS (NFS)

cm -2 · V -1

0.0

Number of fast surface states

NWM

 

0.0

Narrow width modifier

SCM

 

0.0

Short-channel drain source voltage multiplier

VT (VTO)

V

0.0

Extrapolated threshold voltage

XJ

µm

1.5

Junction depth

Mobility Parameters

Name (Alias)

Units

Default

Description

FRC

Å · s/cm 2

0.0

Field reduction coefficient

FSB

V 1/2 · s/cm 2

0.0

Lateral mobility coefficient

UB (UO)

cm 2 /
(V · s)

0.0

Low field bulk mobility

UH

cm 2 /
(V · s)

900 (N) 300 (P)*

Implant - channel mobility
* (For depletion model only)

VST

cm/s

0.0

Saturation velocity

Capacitance Parameters

Name (Alias)

Units

Default

Description

AFC

 

1.0

Area factor for MOSFET capacitance

CAPOP

 

6

Gate capacitance selector

METO

µm

0.0

Metal overlap on gate

The LEVEL 5 MOSFET model has been expanded to include two modes: enhancement and depletion. These two modes are accessed by the flag mode parameter, ZENH.

ZENH=1

This enhancement model (default mode) is a portion of Star-Hspice MOS5 and is identical to AMI SPICE MOS LEVEL 4.

ZENH=0

This depletion model is revised in Star-Hspice (from previous depletion mode) and is identical to AMI SPICE MOS LEVEL 5.

The Star-Hspice enhancement and depletion models are basically identical to the AMI models. However, certain aspects have been revised to enhance performance. Using the Star-Hspice enhancement and depletion models provides access to Star-Hspice features as described below.

The Star-Hspice version of the enhancement and depletion models allows the choice of either SPICE-style or ASPEC-style temperature compensation. For LEVEL 5, the default is TLEV=1, invoking ASPEC style temperature compensation. Setting TLEV=0 invokes SPICE-style temperature compensation.

CAPOP=6 represents AMI Gate Capacitance in Star-Hspice. CAPOP=6 is the default setting for LEVEL 5 only. The LEVEL 5 models can also use CAPOP =1, 2, 3.

The parameter ACM defaults to 0 in LEVEL 5, invoking SPICE-style parasitics. ACM also can be set to 1 (ASPEC) or to 2 (Star-Hspice). All MOSFET models follow this convention.

The Star-Hspice option SCALE can be used with the LEVEL 5 model; however, option SCALM cannot be used due to the difference in units.

You must specify the following parameters for MOS LEVEL 5: VTO (VT), TOX, UO (UB), FRC, and NSUB (DNB).

IDS Equations

The LEVEL 5 IDS equations follow.

Cutoff Region,

(See Subthreshold Current, Ids)

On Region,

 

where:

 

 

 

and gate oxide capacitances per unit area are calculated by:

 

Effective Channel Length and Width

The effective channel length and width in the LEVEL 5 model is determined as follows.

 

 

Threshold Voltage, vth

The model parameter VTO is an extrapolated zero-bias threshold voltage of a large device. The effective threshold voltage, including the device size effects and the terminal voltages, is given by:

 

where:

 

 


NOTE: For LEVEL 5 model, you must specify DNB and VTO parameters. The Star-Hspice program computes using DNB and ignores the GAMMA model parameter.

The effective body effect , including the device size effects, is computed as follows.

 

 

 

otherwise,

 

 

 

otherwise,

 

where:

 

Saturation Voltage, vdsat

The saturation voltage due to channel pinch-off at the drain side is computed by:

 

 

If ECV is not equal to 1000, then the program modifies vsat to include carrier velocity saturation effect:

 

where:

 

Mobility Reduction, UBeff

The mobility degradation effect in the LEVEL 5 model is computed by:

 

where:

linear region

saturation region

The channel length modulation effect is defined in the following section.

Channel Length Modulation

The LEVEL 5 model includes the channel length modulation effect by modifying the I ds current as follows:

 

where:

 

The is in microns, assuming XJ is in microns and DNB is in cm -3 .

Subthreshold Current, I ds

This region of operation is characterized by the Fast Surface State (FSS) if it is greater than 1e10. Then the effective threshold voltage, separating the strong inversion region from the weak inversion region, is determined as follows:

 

where:

 

and vt is the thermal voltage.

The I ds is given by:

Weak Inversion Region, vgs <vth

 

Strong Inversion Region,

 


NOTE: The modified threshold voltage (von) produced by FSS is also used in strong inversion; that is, in the mobility equations, von is used instead of vth . .

Depletion Mode DC Model ZENH=0

The LEVEL 5 MOS model uses depletion mode devices as the load element in contemporary standard n-channel technologies Huang, J.S., and Taylor, G.W. "Modeling of an Ion-Implanted Silicon Gate Depletion-Mode IGFET." IEEE Trans. Elec. Dev., Vol. ED-22, pp. 995-1000, Nov. 1975. . This model was formulated assuming a silicon gate construction with an ion implant used to obtain the depletion characteristics. A special model is required for depletion devices because the implant used to create the negative threshold also results in a complicated impurity concentration profile in the substrate. The implant profile changes the basis for the traditional calculation of the bulk charge, QB. The additional charge from the implant, QBI, must be calculated.

This implanted layer also causes the formation of an additional channel, offering a conductive pathway through the bulk silicon, as well as through the surface channel. This second pathway can cause difficulties when trying to model a depletion device with existing MOS models. The bulk channel is partially shielded from the oxide interface by the surface channel, and the mobility of the bulk silicon can be substantially higher. Yet with all the differences, a depletion model still can share the same theoretical basis as the Ihantola and Moll gradual channel model.

The depletion model differs from the Ihantola and Moll model as follows:

In the depletion model, the gain is lower at low gate voltages and higher at high gate voltages. This variation in gain is the reason the enhancement models cannot generate an accurate representation for a depletion device. The physical model for a depletion device is basically the same as an enhancement model, except that the depletion implant is approximated by a one-step profile with a depth DP.

Due to the implant profile, the drain current equation must be calculated by region. MOSFET device model LEVEL 5 has three regions: depletion, enhancement, and partial enhancement.

Depletion Region, vgs - vfb < 0

The low gate voltage region is dominated by the bulk channel.

Enhancement Region, vgs - vfb > 0, vds < vgs - vfb

The region is defined by high gate voltage and low drain voltage. In the enhancement region, both channels are fully turned on.

Partial enhancement region, vgs - vfb > 0, vds > vgs - vfb

The region has high gate and drain voltages, resulting in the surface region being partially turned on and the bulk region being fully turned on.

IDS Equations, Depletion Model LEVEL 5

The IDS equations for a LEVEL 5 depletion model follow.

Depletion, vgs-vfb <0

 

Enhancement, vgs-vfb

 

Partial Enhancement, vgs-vfb<vde

 

where:

 

 

 

 

 

 

and:

 

The saturation voltage, threshold voltage, and effective are described in the following sections.

Threshold Voltage, vth

The model parameter VTO is an extrapolated zero-bias threshold voltage for a large device. The effective threshold voltage, including the device size effects and the terminal voltages, is calculated as follows:

 

where:

 

 

 

 

 

 

The effective , including small device size effects, is computed as follows:

 

where:

If SCM <= 0,

 

otherwise,

 

If NWM <= 0,

 

otherwise,

 

where:

 


NOTE: When vgs <= vth, the surface is inverted and a residual DC current exists.When vsb is large enough to make vth > vinth, then vth is used as the inversion threshold voltage. In order to determine the residual current, vinth is inserted into the I ds , vsat, and mobility equation in place of vgs (except for vgs in the exponential term of the subthreshold current). The inversion threshold voltage at a given vsb is vinth, which is computed as:

Saturation Voltage, vdsat

The saturation voltage (vsat) is determined as:

 

 

IF ECV is not equal to 1000 (V/µm), Star-Hspice modifies vsat to include the carrier velocity saturation effect.

 

where:

 

Mobility Reduction, UBeff

The surface mobility (UB) is dependent upon terminal voltages as follows:

 

where:

Linear region

Saturation region

The channel length modulation effect is defined next.

Channel Length Modulation

The channel length modulation effect is included by modifying the I ds current as:

 

where:

 

The parameter is in microns, assuming XJ is in microns and na1 is in cm -3 .

Subthreshold Current, I ds

When device leakage currents become important for operation near or below the normal threshold voltage, the subthreshold characteristics are considered. The Star-Hspice LEVEL 5 model uses the subthreshold model only if the number of fast surface states (that is, the FSS) is greater than 1e10. An effective threshold voltage (von) is then determined:

 

where:

 

If von < vinth, then vinth is substituted for von.


NOTE: The Star-Hspice LEVEL 5 model uses the following subthreshold model only if vgs < von and the device is either in partial or full enhancement mode. Otherwise, it use the model in enhancement mode (ZENH=1). The subthreshold current calculated below includes the residual DC current.

If vgs <von then,

Partial Enhancement, vgs-vfb < vde

 

Full Enhancement, vgs-vfb vde > 0

 

Example

FILE ML5IV.SP HSPICE LEVEL 5 MODEL EXAMPLES

*OUTPUT CHARACTERISTICS FOR ENHANCEMENT & DEPLETION MODE

.OPT ACCT LIST CO=132

.OP

VDS 3 0 .1

VGS 2 0

M1 1 2 0 0 MODEN L=20U W=20U

Enhancement Mode

.MODEL MODEN NMOS LEVEL=5

+ VT=.7 TOX=292 FRC=2.739E-2 DNB=2.423E16 UB=642.8

+ OXETCH=-.98 XJ=.29 LATD=.34 ECV=4 VST=5.595E7

+ FSB=7.095E-5 SCM=.4 FSS=2.2E11 NWM=.93 PHI=.61

+ TCV=1.45E-3 PTC=9E-5 BEX=1.8

*

VIDS 3 1

.DC VGS 0 5 0.2

.PRINT DC I(VIDS) V(2)

.PLOT DC I(VIDS)

$$$$$$

.ALTER

$$$$$$

M1 1 2 0 0 MODDP L=20U W=20U

Depletion Mode

.MODEL MODDP NMOS LEVEL=5 ZENH=0.

+ VT=-4.0 FRC=.03 TOX=800 DNB=6E14 XJ=0.8 LATD=0.7

+ DEL=0.4 CJ=0.1E-3 PHI=0.6 EXA=0.5 EXP=0.5 FSB=3E-5

+ ECV=5 VST=4E7 UB=850 SCM=0.5 NI=5.5E11 DP=0.7 UH=1200

*

.END

Star-Hspice Manual - Release 2001.2 - June 2001