LEVEL 38 IDS: Cypress Depletion Model
The LEVEL 38 Cypress Depletion MOSFET model (Cypress Semiconductor Corporation) is a further development of the Star-Hspice LEVEL 5 model and features:
-
BSIM-style length and width sensitivities
-
Degraded body effect at high substrate bias (second GAMMA)
-
Empirical fitting parameters for Ids current calculations in the depletion mode of operations
-
A comprehensive surface mobility equation
-
Drain-induced barrier lowering
At the default parameter settings, the LEVEL 38 model is basically backwards-compatible with LEVEL 5 /ZENH=0.0, with the exception of the surface mobility degradation equation (see the discussion below). Refer to the documentation for LEVEL 5 for the underlying physics that forms the foundation for the Huang-Taylor construct.
In LEVEL 38, the temperature compensation for threshold is ASPEC-style, concurring with the default in LEVEL 5. This section introduces and documents model parameters unique to this depletion model and additional temperature compensation parameters.
LEVEL 38 allows the use of all Star-Hspice capacitance options (CAPOP). CAPOP=2 is the default setting for LEVEL 38. By setting CAPOP=6 (AMI capacitance model), LEVEL 38 capacitance calculations become identical to those of LEVEL 5.
The parameter ACM default (ACM=0 in LEVEL 38) invokes SPICE-style parasitics. ACM also can be set to 1 (ASPEC), or to 2 (Star-Hspice). All MOSFET models follow this convention.
Star-Hspice option SCALE can be used with the LEVEL 5 model. However, option SCALM cannot be used due to the difference in units. Option DERIV cannot be used.
The following parameters must be specified for MOS LEVEL 38: VTO (VT), TOX, UO (UB), FRC, ECV, and NSUB (DNB).
As with LEVEL 5, the Ids current is calculated according to three gate voltage regions:
Depletion Region, vgs - vfb < 0
The low gate voltage region dominated by the bulk channel.
Enhancement Region, vgs - vfb > 0, vds < vgs - vfb
The region defined by high gate voltage and low drain voltage. In the enhancement region, both channels are fully turned on.
Partial enhancement region, vgs - vfb > 0, vds > vgs - vfb
The region with high gate and drain voltages, resulting in the surface region being partially turned on and the bulk region being fully turned on.
To better model depletion region operations, empirical fitting constants have been added to the original Huang-Taylor mechanism to account for the effects caused by nonuniform channel implants and also to make up for an oversight in the average capacitance construct
Marciniak, W. et. al., "Comments on the Huang and Taylor Model of Ion-Implanted Silicon-gate Depletion-Mode IGFET," Solid State Electron., Vol. 28, No.3, pp. 313-315, 1985.
. For the enhancement region, a significantly more elaborate surface mobility model is used.
Body effect in LEVEL 38 is calculated in two regions
Ballay, N. et. al., "Analytic Modeling of Depletion-Mode MOSFET with Short- and Narrow-Channel Effects," IEEE PROC, Vol. 128, Pt.I, No.6 (1981).
:
Bulk body effect, vsb-vsbc > 0.
With sufficiently high (and negative) substrate bias (exceeding vsbc), the depletion region at the implanted channel-substrate junction reaches the Si-oxide interface. Under such circumstances, the free carriers can only accumulate at the interface (like in an enhancement device) and the body effect is determined by the bulk doping level.
Implant-dominated body effect, vsb-vsbc < 0
Before reaching vsbc, and as long as the implant dose overwhelms the substrate doping level, the body effect of the depletion mode device is dominated by the deeply "buried" transistor due to the implant. The body effect coefficient
is proportional to both the substrate doping and, to first order, the implant depth. In this model level, the "amplification" of the body effect due to deep implant is accounted for by an empirical parameter, BetaGam.
Model parameters that start with L or W represent geometric sensitivities. In the model equations, a quantity denoted by zX (X being the variable name) is determined by three model parameters: the large-and-wide channel case value X and length and width sensitivities LX and WX, according to zX=X+LX/Leff+WX/Weff. For example, the zero field surface mobility is given by
NOTE: This model uses mostly micrometer units rather than the typical meter units. Units and defaults are often unique in LEVEL 38. The I
ds
derivatives that give small signal gains gm, gds, and gmbs are calculated using the finite difference method. The options SCALM and DERIV are ineffective for this model.
LEVEL 38 Model Parameters
The LEVEL 38 model parameters follow.
Basic Model Parameters
Name (Alias)
|
Units
|
Default
|
Description
|
LEVEL
|
|
1.0
|
Model level selector. This parameter is set to 38 for this model.
|
DNB (NSUB)
|
cm
-3
|
0.0
|
Surface doping density.
|
DP
|
µm
|
1.0
|
Implant depth
|
ECV
|
V/µm
|
1000
|
Critical field
|
KCS
|
|
2.77
|
Implant capacitance integration constant
|
NI
|
cm
-2
|
2e11
|
Implant doping
|
PHI
|
V
|
0.8
|
Built-in potential
|
TOX
|
Å
|
0.0
|
Oxide thickness
|
Effective Width and Length Parameters
Name (Alias)
|
Units
|
Default
|
Description
|
DEL (WDEL)
|
m
|
0.0
|
Channel length reduction on each side
|
LATD (LD)
|
m
|
1.7 · XJ
|
Lateral diffusion on each side
|
LDAC
|
m
|
|
This parameter is the same as LD, but if LDAC is included in the .MODEL statement, it replaces LD in the Leff calculation for AC gate capacitance.
|
LMLT
|
|
1.0
|
Length shrink factor
|
OXETCH
|
µ
m
|
0.0
|
Oxide etch
|
WMLT
|
|
1.0
|
Diffusion layer and width shrink factor
|
Threshold Voltage Parameters
Name (Alias)
|
Units
|
Default
|
Description
|
FSS (NFS)
|
cm
-2
·V
-1
|
0.0
|
Number of fast surface states
|
NWM
|
|
0.0
|
Narrow width modifier
|
SCM
|
|
0.0
|
Short-channel drain source voltage multiplier
|
BetaGam
|
|
1.0
|
Body effect transition ratio
|
LBetaGam
|
µ
m
|
0.0
|
BetaGam dependence on channel length
|
WBetaGam
|
µ
m
|
0.0
|
BetaGam dependence on channel width
|
DVSBC
|
V
|
0.0
|
Empirical body effect transition voltage adjustment
|
LDVSBC
|
V
·
µ
m
|
0.0
|
L-dependent body effect transition voltage adjustment
|
WDVSBC
|
V
·
µ
m
|
0.0
|
W-dependent body effect transition voltage adjustment
|
TDVSBC
|
V/K
|
0.0
|
Body effect transition voltage shift due to temperature
|
VT (VTO)
|
V
|
0.0
|
Extrapolated threshold voltage
|
LVT (LVTO)
|
V
·
µ
m
|
0.0
|
VT dependence on channel length
|
WVT (WVTO)
|
V
·
µ
m
|
0.0
|
VT dependence on channel width
|
ETA
|
|
0.0
|
Channel-length independent drain-induced barrier lowering
|
LETA(DIBL)
|
µm
|
0.0
|
Channel-length dependent drain-induced barrier lowering
|
WETA
|
µm
|
0.0
|
Channel-width dependent drain-induced barrier lowering
|
DVIN
|
V
|
0.0
|
Empirical surface inversion voltage adjustment
|
XJ
|
µm
|
1.5
|
Junction depth
|
Mobility Parameter
s
Name (Alias)
|
Units
|
Default
|
Description
|
FRC
|
Å
·
s/cm
2
|
0.0
|
Field reduction coefficient
|
LFRC
|
10-4Å·s/cm
|
0.0
|
FRC sensitivity to effective channel length
|
WFRC
|
10-4Å·s/cm
|
0.0
|
FRC sensitivity to effective channel width
|
VFRC
|
Å
·
s/
(cm
2
·
V)
|
0.0
|
Field reduction coefficient variation due to drain bias
|
LVFRC
|
10-4Å
·
s/(cm
·
V)
|
0.0
|
VFRC sensitivity to effective channel length
|
WVFRC
|
10-4Å
·
s/(cm
·
V)
|
0.0
|
VFRC sensitivity to effective channel width
|
BFRC
|
Å
·
s/(cm
2
·
V)
|
0.0
|
Field reduction coefficient variation due to substrate bias.
|
LBFRC
|
10-4Å
·
s/(cm
·
V)
|
0.0
|
BFRC sensitivity to effective channel length
|
WBFRC
|
10-4Å
·
s/(cm
·
V)
|
0.0
|
BFRC sensitivity to effective channel width
|
FSB
|
V
1/2
·
s/cm
2
|
0.0
|
Substrate bias-induced mobility degradation coefficient
|
LFSB
|
10-4V
1/2
·
s/cm
|
0.0
|
FSB sensitivity to effective channel length
|
WFSB
|
10-4V
1/2
·
s/cm
|
0.0
|
FSB sensitivity to effective channel width
|
UO (UB)
|
cm
2
/
(V
·
s)
|
600
|
Low field bulk mobility
|
LUO(LUB)
|
cm
2
·
µ
m
/(V
·
s)
|
0.0
|
UO sensitivity to effective channel length
|
WUO(WUB)
|
cm
2
·
µ
m
/(V
·
s)
|
0.0
|
UO sensitivity to effective channel width
|
FRCEX(F1EX)
|
|
0.0
|
Temperature coefficient for FRC
|
UH
|
cm
2
/
(V
·
s)
|
900
|
Implant-channel mobility
|
KBeta1
|
|
1.0
|
Effective implant-channel mobility modifier
|
LKBeta1
|
µ
m
|
0.0
|
Length-dependent implant-channel mobility modifier
|
WKBeta1
|
µ
m
|
0.0
|
Width-dependent implant-channel mobility modifier
|
KI0(KIO)
|
|
1.0
|
Residue current coefficient
|
LKI0(LKIO)
|
µ
m
|
0.0
|
Length-dependent residue current coefficient
|
WKI0(WKIO)
|
µ
m
|
0.0
|
Width-dependent residue current coefficient
|
HEX(TUH)
|
|
-1.5
|
Implant channel mobility temperature exponent
|
BEX
|
|
-1.5
|
Surface channel mobility temperature exponent
|
VST
|
cm/s
|
0.0
|
Saturation velocity
|
UHSAT
|
µ
m
/V
|
0.0
|
Implant-channel mobility saturation factor
|
Capacitance Parameters
Name (Alias)
|
Units
|
Default
|
Description
|
AFC
|
|
1.0
|
Area factor for MOSFET capacitance
|
CAPOP
|
|
6
|
Gate capacitance selector
|
METO
|
µ
m
|
0.0
|
Metal overlap on gate
|
LEVEL 38 Model Equations
The LEVEL 38 model equations follow.
IDS Equations
Depletion, vgs-vfb <0
Enhancement, vgs-vfb
vde >0
Partial Enhancement, vgs-vfb<vde
where:
and:
The temperature dependence of the mobility terms assume the ordinary exponential form:
The continuity term at the body effect transition point is given by
for vsb>vsbc;
otherwise.
The saturation voltage, threshold voltage, body effect transition voltage, and body effect coefficient
are described in the following sections.
Threshold Voltage, vth
The model parameter VTO, often called the "pinch-off," is a zero-bias threshold voltage extrapolated from a large device operating in the depletion mode. The effective pinch-off threshold voltage, including the device size effects and the terminal voltages, is given by:
where:
for vsb > vsbc; 0 otherwise.
The effective
, including small device size effects, is computed as follows:
for vsb>vsbc, and =g otherwise.
where:
If SCM
<=
0,
otherwise,
If NWM
<=
0,
otherwise,
where:
The body effect transition point is calculated as follows:
When vgs
<=
vth, the surface is inverted and a residual DC current exists. When vsb is large enough to make vth > vinth, then vth is used as the inversion threshold voltage.
In order to determine the residual current, vinth is inserted into the ids, vsat, and mobility equation in place of vgs (except for vgs in the exponential term of the subthreshold current). The inversion threshold voltage at a given vsb is vinth, which is computed as:
Saturation Voltage, vdsat
The saturation voltage vsat is determined by:
Star-Hspice modifies vsat to include carrier velocity saturation effect:
where:
Mobility Reduction, UBeff
The surface mobility UB is dependent upon terminal voltages as follows:
where:
Linear region
Saturation region
and at elevated temperatures
The
L is the channel length modulation effect, defined in the next section. Note that v
fb
assumes the role of v
th
in the LEVEL 5 mobility equation. The degradation parameters are semi-empirical and grouped together according to their (linearized) mathematical dependencies instead of physical origin to better provide parameter extraction.
Tsividis, Y. Operations and Modeling of the MOS Transistor, McGraw-Hill, New York, 1987 p. 145; p. 241f. BFRC's counterpart in BSIM is x2u0.
Channel Length Modulation
The channel length modulation effect is included by modifying the ids current as follows:
where:
The
L is in microns, assuming XJ is in microns and na1 is in cm
-3
.
Subthreshold Current, ids
When device leakage currents become important for operation near or below the normal threshold voltage, the model considers the subthreshold characteristics. In the presence of surface states, the effective threshold voltage von is determined by:
where:
If vgs <von, then
Partial Enhancement, 0< vgs-vfb < vde
Full Enhancement, vgs-vfb
-vde > 0
Depletion, vgs-vfb
< 0
Example Model File
$ file Depstor.mod
.MODEL DEPSTOR NMOS LEVEL=38
* PARASITIC ELEMENTS
+ ACM=1
+ LD=0.15u WD=0.2u $ for LEFF AND WEFF
+ CJ=0.3E-16 MJ=0.4 PB=0.8 JS=2.0E-17 $ INTRINSIC DIODE
+ CJSW=0 MJSW=0.3
+ BULK=98 $ DEFAULT NODE FOR SUBSTRATE
* THRESHOLD
+ VTO=-2.5 LVT=-0.25 WVT=0
+ leta=0.02 eta=0.0 weta=0.0
+ TCV=0.003 $ TEMPERATURE COEFFICIENT
* MISC
+ DVIN=0.5 PHI=0.75
+ NFS=2e10 DNB=3.0E16
Mobility Model
+ UH= 1300
+ UO=495 FRC= 0.020 FSB=5e-5 VFRC=-1e-4 BFRC=-0
+ LUO=-100 LFRC=.03 LFSB=-1e-5 LVFRC=-.002 LBFRC=-1e-3
+ WUO=-30 WFRC=-0.01 WFSB=5e-5 WVFRC=-0.00
+ WBFRC=-0.4e-3
+ KI0= .9 KBETA1=.5
+ LKI0=0.16 LKBETA1=-0.15
+ WKI0=0.0 WKBETA1=-0.0
+ BEX=-1.3 TUH=-1.0 Frcex=1.0
Body Effect
+ NWM=0.5 SCM=.1
+ DVSBC=0.1 LDVSBC=0 WDVSBC=0
+ TDVSBC=.002
+ BetaGam=0.9 LBetaGam=-.2 WBetaGam=.1
Saturation
+ ECV= 2.9 VST=8000 UHSAT=0
* CHANNEL LENGTH MODULATION
+ XJ= 0.1
* OXIDE THICKNESS AND CAPACITANCE
+ TOX=165 CGSO=0 CAPOP=2
* CHANNEL IMPLANT
+ NI=1.5e12 KCS=3 DP=0.25
*.END
Star-Hspice Manual - Release 2001.2 - June 2001