LEVEL 38 IDS: Cypress Depletion Model

The LEVEL 38 Cypress Depletion MOSFET model (Cypress Semiconductor Corporation) is a further development of the Star-Hspice LEVEL 5 model and features:

At the default parameter settings, the LEVEL 38 model is basically backwards-compatible with LEVEL 5 /ZENH=0.0, with the exception of the surface mobility degradation equation (see the discussion below). Refer to the documentation for LEVEL 5 for the underlying physics that forms the foundation for the Huang-Taylor construct.

In LEVEL 38, the temperature compensation for threshold is ASPEC-style, concurring with the default in LEVEL 5. This section introduces and documents model parameters unique to this depletion model and additional temperature compensation parameters.

LEVEL 38 allows the use of all Star-Hspice capacitance options (CAPOP). CAPOP=2 is the default setting for LEVEL 38. By setting CAPOP=6 (AMI capacitance model), LEVEL 38 capacitance calculations become identical to those of LEVEL 5.

The parameter ACM default (ACM=0 in LEVEL 38) invokes SPICE-style parasitics. ACM also can be set to 1 (ASPEC), or to 2 (Star-Hspice). All MOSFET models follow this convention.

Star-Hspice option SCALE can be used with the LEVEL 5 model. However, option SCALM cannot be used due to the difference in units. Option DERIV cannot be used.

The following parameters must be specified for MOS LEVEL 38: VTO (VT), TOX, UO (UB), FRC, ECV, and NSUB (DNB).

As with LEVEL 5, the Ids current is calculated according to three gate voltage regions:

Depletion Region, vgs - vfb < 0

The low gate voltage region dominated by the bulk channel.

Enhancement Region, vgs - vfb > 0, vds < vgs - vfb

The region defined by high gate voltage and low drain voltage. In the enhancement region, both channels are fully turned on.

Partial enhancement region, vgs - vfb > 0, vds > vgs - vfb

The region with high gate and drain voltages, resulting in the surface region being partially turned on and the bulk region being fully turned on.

To better model depletion region operations, empirical fitting constants have been added to the original Huang-Taylor mechanism to account for the effects caused by nonuniform channel implants and also to make up for an oversight in the average capacitance construct Marciniak, W. et. al., "Comments on the Huang and Taylor Model of Ion-Implanted Silicon-gate Depletion-Mode IGFET," Solid State Electron., Vol. 28, No.3, pp. 313-315, 1985. . For the enhancement region, a significantly more elaborate surface mobility model is used.

Body effect in LEVEL 38 is calculated in two regions Ballay, N. et. al., "Analytic Modeling of Depletion-Mode MOSFET with Short- and Narrow-Channel Effects," IEEE PROC, Vol. 128, Pt.I, No.6 (1981). :

Bulk body effect, vsb-vsbc > 0.

With sufficiently high (and negative) substrate bias (exceeding vsbc), the depletion region at the implanted channel-substrate junction reaches the Si-oxide interface. Under such circumstances, the free carriers can only accumulate at the interface (like in an enhancement device) and the body effect is determined by the bulk doping level.

Implant-dominated body effect, vsb-vsbc < 0

Before reaching vsbc, and as long as the implant dose overwhelms the substrate doping level, the body effect of the depletion mode device is dominated by the deeply "buried" transistor due to the implant. The body effect coefficient is proportional to both the substrate doping and, to first order, the implant depth. In this model level, the "amplification" of the body effect due to deep implant is accounted for by an empirical parameter, BetaGam.

Model parameters that start with L or W represent geometric sensitivities. In the model equations, a quantity denoted by zX (X being the variable name) is determined by three model parameters: the large-and-wide channel case value X and length and width sensitivities LX and WX, according to zX=X+LX/Leff+WX/Weff. For example, the zero field surface mobility is given by

 


NOTE: This model uses mostly micrometer units rather than the typical meter units. Units and defaults are often unique in LEVEL 38. The I ds derivatives that give small signal gains gm, gds, and gmbs are calculated using the finite difference method. The options SCALM and DERIV are ineffective for this model.

LEVEL 38 Model Parameters

The LEVEL 38 model parameters follow.

Basic Model Parameters

Name (Alias)

Units

Default

Description

LEVEL

 

1.0

Model level selector. This parameter is set to 38 for this model.

DNB (NSUB)

cm -3

0.0

Surface doping density.

DP

µm

1.0

Implant depth

ECV

V/µm

1000

Critical field

KCS

 

2.77

Implant capacitance integration constant

NI

cm -2

2e11

Implant doping

PHI

V

0.8

Built-in potential

TOX

Å

0.0

Oxide thickness

Effective Width and Length Parameters

Name (Alias)

Units

Default

Description

DEL (WDEL)

m

0.0

Channel length reduction on each side

LATD (LD)

m

1.7 · XJ

Lateral diffusion on each side

LDAC

m

 

This parameter is the same as LD, but if LDAC is included in the .MODEL statement, it replaces LD in the Leff calculation for AC gate capacitance.

LMLT

 

1.0

Length shrink factor

OXETCH

µ m

0.0

Oxide etch

WMLT

 

1.0

Diffusion layer and width shrink factor

Threshold Voltage Parameters

Name (Alias)

Units

Default

Description

FSS (NFS)

cm -2 ·V -1

0.0

Number of fast surface states

NWM

 

0.0

Narrow width modifier

SCM

 

0.0

Short-channel drain source voltage multiplier

BetaGam

 

1.0

Body effect transition ratio

LBetaGam

µ m

0.0

BetaGam dependence on channel length

WBetaGam

µ m

0.0

BetaGam dependence on channel width

DVSBC

V

0.0

Empirical body effect transition voltage adjustment

LDVSBC

V · µ m

0.0

L-dependent body effect transition voltage adjustment

WDVSBC

V · µ m

0.0

W-dependent body effect transition voltage adjustment

TDVSBC

V/K

0.0

Body effect transition voltage shift due to temperature

VT (VTO)

V

0.0

Extrapolated threshold voltage

LVT (LVTO)

V · µ m

0.0

VT dependence on channel length

WVT (WVTO)

V · µ m

0.0

VT dependence on channel width

ETA

 

0.0

Channel-length independent drain-induced barrier lowering

LETA(DIBL)

µm

0.0

Channel-length dependent drain-induced barrier lowering

WETA

µm

0.0

Channel-width dependent drain-induced barrier lowering

DVIN

V

0.0

Empirical surface inversion voltage adjustment

XJ

µm

1.5

Junction depth

Mobility Parameter s

Name (Alias)

Units

Default

Description

FRC

Å · s/cm 2

0.0

Field reduction coefficient

LFRC

10-4Å·s/cm

0.0

FRC sensitivity to effective channel length

WFRC

10-4Å·s/cm

0.0

FRC sensitivity to effective channel width

VFRC

Å · s/
(cm 2 · V)

0.0

Field reduction coefficient variation due to drain bias

LVFRC

10-4Å · s/(cm · V)

0.0

VFRC sensitivity to effective channel length

WVFRC

10-4Å · s/(cm · V)

0.0

VFRC sensitivity to effective channel width

BFRC

Å · s/(cm 2 · V)

0.0

Field reduction coefficient variation due to substrate bias.

LBFRC

10-4Å · s/(cm · V)

0.0

BFRC sensitivity to effective channel length

WBFRC

10-4Å · s/(cm · V)

0.0

BFRC sensitivity to effective channel width

FSB

V 1/2 · s/cm 2

0.0

Substrate bias-induced mobility degradation coefficient

LFSB

10-4V 1/2 · s/cm

0.0

FSB sensitivity to effective channel length

WFSB

10-4V 1/2 · s/cm

0.0

FSB sensitivity to effective channel width

UO (UB)

cm 2 /
(V · s)

600

Low field bulk mobility

LUO(LUB)

cm 2 · µ m /(V · s)

0.0

UO sensitivity to effective channel length

WUO(WUB)

cm 2 · µ m /(V · s)

0.0

UO sensitivity to effective channel width

FRCEX(F1EX)

 

0.0

Temperature coefficient for FRC

UH

cm 2 /
(V · s)

900

Implant-channel mobility

KBeta1

 

1.0

Effective implant-channel mobility modifier

LKBeta1

µ m

0.0

Length-dependent implant-channel mobility modifier

WKBeta1

µ m

0.0

Width-dependent implant-channel mobility modifier

KI0(KIO)

 

1.0

Residue current coefficient

LKI0(LKIO)

µ m

0.0

Length-dependent residue current coefficient

WKI0(WKIO)

µ m

0.0

Width-dependent residue current coefficient

HEX(TUH)

 

-1.5

Implant channel mobility temperature exponent

BEX

 

-1.5

Surface channel mobility temperature exponent

VST

cm/s

0.0

Saturation velocity

UHSAT

µ m /V

0.0

Implant-channel mobility saturation factor

Capacitance Parameters

Name (Alias)

Units

Default

Description

AFC

 

1.0

Area factor for MOSFET capacitance

CAPOP

 

6

Gate capacitance selector

METO

µ m

0.0

Metal overlap on gate

LEVEL 38 Model Equations

The LEVEL 38 model equations follow.

IDS Equations

Depletion, vgs-vfb <0

 

Enhancement, vgs-vfb vde >0

 

Partial Enhancement, vgs-vfb<vde

 

where:

 

 

 

 

 

 

and:

 

The temperature dependence of the mobility terms assume the ordinary exponential form:

 

 

The continuity term at the body effect transition point is given by

 

for vsb>vsbc; otherwise.

The saturation voltage, threshold voltage, body effect transition voltage, and body effect coefficient are described in the following sections.

Threshold Voltage, vth

The model parameter VTO, often called the "pinch-off," is a zero-bias threshold voltage extrapolated from a large device operating in the depletion mode. The effective pinch-off threshold voltage, including the device size effects and the terminal voltages, is given by:

 

where:

 

for vsb > vsbc; 0 otherwise.

 

 

 

 

 

The effective , including small device size effects, is computed as follows:

for vsb>vsbc, and =g otherwise.

 

where:

If SCM <= 0,

 

otherwise,

 

If NWM <= 0,

 

otherwise,

 

where:

 

The body effect transition point is calculated as follows:

 

When vgs <= vth, the surface is inverted and a residual DC current exists. When vsb is large enough to make vth > vinth, then vth is used as the inversion threshold voltage.

In order to determine the residual current, vinth is inserted into the ids, vsat, and mobility equation in place of vgs (except for vgs in the exponential term of the subthreshold current). The inversion threshold voltage at a given vsb is vinth, which is computed as:

 

Saturation Voltage, vdsat

The saturation voltage vsat is determined by:

 

 

Star-Hspice modifies vsat to include carrier velocity saturation effect:

 

where:

 

Mobility Reduction, UBeff

The surface mobility UB is dependent upon terminal voltages as follows:

 

where:

Linear region

Saturation region

and at elevated temperatures

The L is the channel length modulation effect, defined in the next section. Note that v fb assumes the role of v th in the LEVEL 5 mobility equation. The degradation parameters are semi-empirical and grouped together according to their (linearized) mathematical dependencies instead of physical origin to better provide parameter extraction. Tsividis, Y. Operations and Modeling of the MOS Transistor, McGraw-Hill, New York, 1987 p. 145; p. 241f. BFRC's counterpart in BSIM is x2u0.

Channel Length Modulation

The channel length modulation effect is included by modifying the ids current as follows:

 

where:

 

The L is in microns, assuming XJ is in microns and na1 is in cm -3 .

Subthreshold Current, ids

When device leakage currents become important for operation near or below the normal threshold voltage, the model considers the subthreshold characteristics. In the presence of surface states, the effective threshold voltage von is determined by:

 

where:

 

If vgs <von, then

Partial Enhancement, 0< vgs-vfb < vde

 

Full Enhancement, vgs-vfb -vde > 0

 

Depletion, vgs-vfb < 0

Example Model File

$ file Depstor.mod

.MODEL DEPSTOR NMOS LEVEL=38

* PARASITIC ELEMENTS

+ ACM=1

+ LD=0.15u WD=0.2u $ for LEFF AND WEFF

+ CJ=0.3E-16 MJ=0.4 PB=0.8 JS=2.0E-17 $ INTRINSIC DIODE

+ CJSW=0 MJSW=0.3

+ BULK=98 $ DEFAULT NODE FOR SUBSTRATE

* THRESHOLD

+ VTO=-2.5 LVT=-0.25 WVT=0

+ leta=0.02 eta=0.0 weta=0.0

+ TCV=0.003 $ TEMPERATURE COEFFICIENT

* MISC

+ DVIN=0.5 PHI=0.75

+ NFS=2e10 DNB=3.0E16

Mobility Model

+ UH= 1300

+ UO=495 FRC= 0.020 FSB=5e-5 VFRC=-1e-4 BFRC=-0

+ LUO=-100 LFRC=.03 LFSB=-1e-5 LVFRC=-.002 LBFRC=-1e-3

+ WUO=-30 WFRC=-0.01 WFSB=5e-5 WVFRC=-0.00
+ WBFRC=-0.4e-3

+ KI0= .9 KBETA1=.5

+ LKI0=0.16 LKBETA1=-0.15

+ WKI0=0.0 WKBETA1=-0.0

+ BEX=-1.3 TUH=-1.0 Frcex=1.0

Body Effect

+ NWM=0.5 SCM=.1

+ DVSBC=0.1 LDVSBC=0 WDVSBC=0

+ TDVSBC=.002

+ BetaGam=0.9 LBetaGam=-.2 WBetaGam=.1

Saturation

+ ECV= 2.9 VST=8000 UHSAT=0

* CHANNEL LENGTH MODULATION

+ XJ= 0.1

* OXIDE THICKNESS AND CAPACITANCE

+ TOX=165 CGSO=0 CAPOP=2

* CHANNEL IMPLANT

+ NI=1.5e12 KCS=3 DP=0.25

*.END

Star-Hspice Manual - Release 2001.2 - June 2001