http://larc.ee.nthu.edu.tw/~dtc/doc/940603.pdf
Each SRAM has two cross-coupled inverters. This storage cell has two stable states which are used to denote 0 and 1. An SRAM cell has three different states. It can be in: standby (the circuit is idle), reading (the data has been requested) and writing (updating the contents). The SRAM to operate in read mode and write mode should have "readability" and "write stability" respectively. SRAM is more expensive, but faster and significantly less power hungry (especially idle) than DRAM.
hour | day | year | fit | address | bits | |
1000 | 41.66667 | 0.114155 | 10 | 1.02E+03 | ||
1.00E+06 | 41666.67 | 114.1553 | 20 | 1.05E+06 | ||
1.00E+05 | 4166.667 | 11.41553 | 30 | 1.07E+09 | ||
168 | 7 | 0.019178 | 4 | 1.60E+01 | ||
8 | 2.56E+02 | |||||
9 | 5.12E+02 | |||||
7 | 1.28E+02 |
1.2 SRAM Designs IBM2005
All SRAM arrays in this technology must utilize dummy edge cells around the
external perimeter of the
array. Any exception to this must be approved by the waiver review board.
Additionally, All SRAMS
designed for this technology MUST have body contacts on the sense amplifier
input nFETs. See section
3.15, “Body Contact Rules” on page 123.
Two cell layout are in review and under development. Both cells are
M1-bitline/M2-wordline design. The first
cell is 1.3mm x 0.5mm (0.65 mm2) in design
dimension. The second cell is 1.5mm x 0.5mm (0.75 mm2) in design
dimension.
a very good article of SRAM theory
http://www.iis.ee.ethz.ch/~kgf/aries/5.html#5.4 saved as 222hs.mhtml
*sram
http://www.southalabama.edu/engineering/ece/faculty/sruss/EE%20534/Lecture%2013.pdf
2K word = 2x2~10
Silicon lab in Austin http://www.silabs.com/about/careers/Pages/search.aspx
example: NML is input start from low, where is the value cause the upset of the out put, in the vo-vin chart, start vin from lower side till the slope =1, NML=@slope1 - low (0v) = 2.3v; NMH the input start from high, where is the value to cause the upset of the output, start vin from vdd till slope is 1, NMH = high (vdd) - slope@1 = 1.7v
more:http://www.ece.unm.edu/~jimp/vlsi/slides/chap2_1.html
These access
transistors are designed to be strong enough to overcome the positive
feedback in the bitcell
core and overwrite the contents of the bitcell. On the other hand, they also
need to be weak
enough that the content of the bitcell is not accidentally disturbed during a
read operation.
Herein lies one of the fundamental constraints in SRAM bitcell design - the
tradeoff between
read and write margin. The cross-coupled inverting gain elements in the core
are usually
implemented as two static CMOS inverters with each static CMOS inverter
consisting of a
PMOS and NMOS transistor. This SRAM bitcell design is usually called a 6T
bitcell due
to the fact that there are 6 transistors in a bitcell.
1.2.1 SRAM Margins
SRAM margins are used to quantify the robustness of a read and write operation.
1.3
(a) illustrates the schematic of a bitcell set up for SRAM static margin
extraction. A
voltage source is connected to one of the internal nodes (CL). This node voltage
is swept
while measuring voltages at other nodes or the current flowing out of this
voltage source
(IN−Curve). Figure 1.3 (b) plots the technique for characterizing the static
noise margin
(SNM) of a bitcell [61]. Both bit-lines and the word-line (BL, BL, WL) are
connected to
VDD. The first curve is measured by sweeping the voltage of node CL while
monitoring
the voltage at node CH. This essentially traces the switching characteristic
of one of the
cross-coupled inverters. The other curve is measured by sweeping node CH while
monitoring
the voltage at node CL. The static noise margin for storing a 0 or 1 (SNM0 and
SNM1)
corresponds to the side of the largest square that fits into the respective
lobes. This static
margin essentially characterizes the largest voltage perturbation that can be
sustained in
the internal nodes of the bitcell before the bitcell looses the ability to store
two states. The
bias conditions applied on the bitcell for write margin characterization depend
on the data
that is being written into the bitcell. To write a logic-0 into node CL, node BL
is grounded
while nodes BL and WL are connected to VDD. The voltage at node CL is then swept
from
VDD to ground while the current flowing through the voltage source (IN−Curve) is
monitored.
This emulates the bias conditions applied to the transistors as a logic-0 is
written to node
CL. IN−Curve observed during this voltage sweep is plotted on Figure 1.3 (c).
The static
write margin(Iwrite) is defined as the minimum current observed at the right
side of the plot
[13]. The Iwrite write margin is preferred over an alternative write noise
margin proposed by
Seevinck et al. because of easier extraction from experimental results and
better correlation
with SRAM write Vmin across a wide range of voltages [24].
understand writing ability in sram PG cuurent must > PU current, (imagine PU current is very high, Iw is negative ...
understand writing ability in sram PG cuurent must > PU current, (imagine PU current is very high, Iw is negative ...
The write N-curve illustrated in Fig. 1.2(b) is obtained by sweeping the
voltage at the
storage node QR (QL), with BL (BL) and WL biased at VDD and BL (BL) biased at
GND,
and monitoring the current sourced into the storage node. The write-ability
current [8, 9],
Iw, is defined as the minimum current past the inverter PUL-PDL trip point, and
is a measure
of the difference between PGR and PUR currents.
SNM is the
maximum tolerable DC noise voltage at a storage node that does not cause a read
disturbance, and it is the length of the side of the largest square that can fit
into the “eyes”
of the butterfly curves, i.e., the read voltage transfer characteristics (VTC),
for the SRAM
cell.
.temp 70
vdd 1 0 dc 1v
m1 3 2 1 1 pmos w=115n l=65n
m2 3 2 0 0 nmos w=130n l=65n
m3 2 3 1 1 pmos w=115n l=65n
m4 2 3 0 0 nmos w=130n l=65n
m5 4 5 3 0 nmos w=100n l=75n
m6 6 5 2 0 nmos w=100n l=75n
.include'/home/student1/65nm_bulk.txt'
vbl 4 0 dc 1v
vblr 6 0 dc 1v
vwl 5 0 dc 1v
vnode 2 0 dc 0v
c1 3 0 10ff ic=1
c2 2 0 10ff ic=0
.dc vnode 0v 1v .2v
.probe dc v(3) v(2)
.option post probe
.end