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IDDQ testing
is linked to the history of CMOS IC design and fabrication. In 1963
Frank Wanlass (Fairchild Semiconductor) originated and published the
concept of complementary-MOS (CMOS) logic circuitry. It occurred to
him that a CMOS circuit would use very little
power and that in standby, it would draw practically nothing - just
the leakage current. The
concept of IDDQ testing (validating circuits by
measuring and observing their quiescent supply current) and its
application to CMOS circuits was developed and demonstrated by Mark
W. Levi in his ITC’1981 paper (“CMOS is most
Testable”, Proceedings of ITC’81, pp. 217-220). It is
therefore a fact that CMOS circuits with increased leakage current
are defective. IDDQ testing
is a test technique based on measuring the Quiescent supply current
of the device under test. A distinction needs to be made between
application to technologies where the leakage current is neglect
able and application to technologies were the leakage current is not
neglectable. The traditional decision criterion - which is valid for
technologies with low leakage currents - is based on the fact that a
CMOS circuit does not draw any significant current when in a stable
situation. In a quiescent state, only the leakage current flows,
which is in most cases can be neglected. The fact that under certain
conditions a significant current flows when the device under test is
in a quiescent state, indicates the presence of a manufacturing
defect in the circuit. Such a defect which causes a current
increase, may have a direct influence on the functionality of the
circuit (functional failure) or may affect the lifetime and
reliability of the circuit negatively ((early) lifetime failure).
Further info on IDDQ and limit setting can be
found on the True
IDDQ page.
For newer technologies, where the leakage current
is not neglectable, a similar observation holds true. In such cases
the base leakage cannot be neglected but needs to be considered as
an offset level. The fact that under certain conditions there is an
increase in the current flowing
when the device under test is in a quiescent state, indicates the
presence of a manufacturing defect in the circuit. Such a defect
which causes a current increase, may have a direct influence on the
functionality of the circuit (functional failure) or may affect the
lifetime and reliability of the circuit negatively ((early) lifetime
failure). By using a relative decision criterion (based on the
comparison of the measured current to the base leakage current)
defects can be screened reliably and effective, even in the
presences of large background currents, provided suitable
measurement tools are used.
IDDQ
testing is a very sensitive technique, able to detect such problems
in an early stage, even before they really harm the circuit. It is
also a proper alternative to replace other, more expensive or more
time-consuming test approaches, needed to guarantee the quality and
reliability of the tested chip. In combination with emission
spectroscopy and spectral analysis IDDQ is also
a very powerful technique for defect location and defect diagnosis,
obviating the need for fibbing.
The IDDQ test technique can be
applied at wafer level, at packed device level, during incoming
inspection, during life tests or even during on-line testing. Making
use of an IDDQ test approach supported by the
use of proper measurement instrumentation offers the following
advantages :
- Increased product quality
- Replacement (or reduction) of Burn-in tests
- Elimination of early lifetime failures
- Increased product reliability
- Reduction of the overall test cost.
- Increase of engineering and failure analysis
productivity.
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